項目

內容

何承諭

Faculty

(Academic staff)

姓名

何承諭

職稱

助理教授

學歷

國立中山大學 電機系 電波組博士

專長

5G毫米波封裝天線模組設計和量測、

高頻封裝基板材料特性萃取、信號完整性/電源完整性/電磁相容

Publication(近五年著作)

Journal paper:

1. C. Y. Ho,  S. C. Hsieh, H. S. Huang, C. C. Wang, and C. P. Hung, “Fabrication Tolerance Analysis and Validation for Millimeter-Wave Antenna-In-Package on Multilayer Substrates ,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 16, no. 8, pp. 1974–1981, 2026. (SCI)
2. C. Y. Ho,  H. H. Cheng, P. C. Pan, C. C. Wang, and C. P. Hung, “A novel channel characteristics estimation methodology for high-speed SerDes interface on flip chip ball grid array (FCBGA) packages,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 53, no. 12, pp. 1784–1792, 2015.. (SCI)
3. C. Y. Ho,  H. H. Cheng, P. C. Pan, C. C. Wang, and C. P. Hung, “Dielectric Characterization of Ultra-thin Low-loss Build-up Substrate for System-in-Package (SiP) Modules,” IEEE Trans. Microwave Theory Techn., vol. 63, no. 9, pp. 2923–2930, Sept. 2015. (SCI)
4. C.Y. Ho, K.S. Chen, T.S. Horng, J.M. Wu, and C.H. Huang, "Method of measuring common-mode current conversion coefficient for estimating variation in radiated emission from printed circuit board components," RADIOENGINEERING, Vol. 23, No. 2, pp. 709-716, Jun. 2014. (SCI)
5. C.Y. H , K.S. Chen , T.S. Horng , J.M. Wu , and C.H. Huang, "Prediction of radiated emissions from microstrip components for RF/microwave circuits using measurement of common-mode current," Journal of Electromagnetic Waves and Applications, Vol. 27, No. 18, pp. 2355-2365, Dec. 2013. (SCI)
6. C.Y. Ho, K.S. Chen, and T.S. Horng, "Estimating the reduction of radiated emissions from microstrip components using network analyzer with a bulk current injection probe," IEEE Microwave and Wireless Components Letters, Vol. 23, No. 2, pp. 108-110, Jan. 2013
7. C.Y. Ho, K.S. Chen, T.S. Horng, J.M. Wu, "Estimating the reduction of radiated emissions from TFT-LCD panel using network analyzer with a bulk current injection probe," Progress in Electromagnetics Research, Vol. 140, pp. 181-197, May 2013. (SCI)
8. C.-Y. Ho, K.-S. Chen, and T.-S. Horng, "Estimating radiated emission reduction from printed circuit board using vector network analyzer with a bulk current injection probe," Progress In Electromagnetics Research, Vol. 135, 1-16, 2013. (SCI)
9. C.-Y. Ho, K.-S. Chen, and T.-S. Horng, “Prediction of Common-Mode Radiated Emission from PCB Using Vector Network Analyzer with a Bulk Injection Current Probe,” Journal of Electromagnetic Waves and Applications,            Vol. 26, No. 16, 2121–2129, 2012. (SCI)

Conference Papers:

1. C. Y. Ho*, P. M. Huang, and Y. P. Sun , “Fabrication tolerance analysis of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM),” International Conference on Electronics Packaging (ICEP), 2026.

2. C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “High performance Antenna-in-Package with test socket for Millimeter-Wave System,” International Conference on Electronics Packaging (ICEP), 2024.

3. S. C. Hsieh, C. Y. Ho*, and C. C. Wang, “Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology,” in Proc. CPMT Symposium Japan (ICSJ), 2023.

4. H. S. Huang, C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “A 2x2 Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems,” in Proc. International                Conference on Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), 2022.

5. W. C. Hsiao, H. S. Huang, C. Y. Ho*, and S. C. Hsieh, “Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems,” in Proc. Electronics Packaging Technology Conference (EPTC), 2022.

6. H. S. Huang, C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM),” in Proc. Electronics Packaging Technology Conference (EPTC), 2022.

7. C. C. Chu, C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “Corner Analysis of Manufacturing Tolerances of 5G mmWave Antenna in Package/Module (AiP/AiM),” in Proc. International Conference on Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), 2021

8. H. S. Huang, C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “Analysis and Optimization of a Multilayer Organic Substrate for mmWave Antenna in Package/Module Application,” in Proc. International Conference on Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), 2021

9. S. C. Hsieh, C. Y. Ho*, and C. C. Wang, “Millimeter-Wave Antenna-in-Package Design Validation Solution in Wireless Communication Applications,” in Proc. CPMT Symposium Japan (ICSJ), 2021

10. S. C. Hsieh, C. Y. Ho*, and C. C. Wang, “Performance Analysis and Test Solution with Integrated Antenna-in-Package for Millimeter-Wave System” in Proc. Electronics System-Integration Technology Conference (ESTC), 2020

11. S. C. Hsieh, F. C. Chu, C. Y. Ho*, W. -Y. Chen and C. -C. Wang, "mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications," in Proc. 70th Electron. Comp. Technol. Conf (ECTC), 2020.

12. C. C. Chu, C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “Low loss Interconnection Solutions of Chip-to-Antenna for Millimeter-Wave Antenna-in-Package Application,” in Proc. International Conference on Microsystems, Packaging, Assembly and Circuits Technology, (IMPACT), 2020. (Best Paper Award)

13. H. S. Huang, C. Y. Ho*, S. C. Hsieh, and C. C. Wang, “The impact of substrate design rule for millimeter-wave antenna-in-package application,” in Proc. International Conference on Microsystems, Packaging, Assembly and Circuits Technology, (IMPACT), 2020.

14. S. C. Hsieh, C. Y. Ho*, and C. C. Wang, “Advanced Thin-Profile Fan-Out with Beamforming Verification for 5G Wideband Antenna,” in Proc. 69th Electron. Comp. Technol. Conf., (ECTC), 2019.

15. S. C. Hsieh, C. Y. Ho*, and C. C. Wang, “mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application,” in Proc. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019.

16. C. Y. Ho*, S. .C Hsieh, and C. C. Wang, “A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications,” in Proc. International Conference on Electronics Packaging (ICEP), 2019.